R&D Capabilities
MYIR has established R&D centers in both Shenzhen and Wuhan, and boasts a senior technical R&D team. Approximately 45% of our personnel are dedicated to R&D, and all of them possess a bachelor's degree or higher. The core and backbone members of our R&D team possess extensive experience in the embedded industry, having accumulated more than 10 years of professional expertise in the field. They are equipped with cutting edge design concepts and practices specially tailored for high volume product applications. Our roducts exhibit industry leading innovation, reliability, and stability, and we have filed for umerous patents, copyrights, and various certifications, exceeding a total of 100.
Excellent, Scientific, and Systematic R&D Management
Technology and Skills
Testing Capability
Signal Test
Standards Range
Corresponding chip data manual
Main Evaluation Items
Power Test
Ground
Impedance Test
Ripple Test
Up-down
Waveform Test
Power On/Off
Timing Test
Power
Consumption Test
Power Noise Test
Signal Test
I2C Test
I2S Test
SDIO Test
Clock Test
Ethernet Test
UART Test
CAN Test
RS232/RS485 Test
EMC Test
Standards Range
EN55032
IEC61000-4
NB/T33008.1
GB/T 17626
Main Evaluation Items
EMI: Electromagnetic Interference
RE: Radiation Emission
Harmonics:
Harmonic Current
CE: Conducted Emissions
Flicker: Flashing
EMS: Electromagnetic Sensitivity
EFT/B:
Electric Fast Transient
Pulse Group
PMS:
Power Frequency
Magnetic Field
Anti-interference Degree
CS:
Conducted Immunity
RS:
Radiation Immunity
Surge: Surge
Immunity
ESD:
Electrostatic Immunity
Dips:
Voltage Drop/
Short Interruption
Certification
Standards Range
EN 55032:2015
EN 55035:2017
IEC62321
EN 61000-3-3:2013
EN IEC 61000-3-2:2019
Main Evaluation Items
CE Certification
RoHS Certification
Reliability Test
Standards Range
GB/T 2423.1-2008
GB/T 2423.8-1995
GB/T 2423.17-2008
GB/T 2423.2-2008
GB/T 2423.10-2019
GB/T 19056-2012
GB/T 2423.22-2012
GB/T 2423.5-2019
Main Evaluation Items