MIC-B5760 Industrial PC Delivers Full Isolation on RS485/CAN FD/RS232/GPIO for Reliable Field Communications
2026-06-26
34
“We kept hearing the same frustration from customers. They'd piece together a standard IPC, a CAN adapter card, and a serial converter — then lose a week to ground loops, driver conflicts, and compatibility issues long before they wrote a line of application code. So we built the MIC‑B5760. One box, one BSP, all the isolated interfaces onboard. We handle the hardware and drivers. The rest is your application.”— Cloud Ye, Product Manager, MYIR Electronics
The MIC‑B5760 is a rugged aluminum‑alloy IPC Box suited for industrial automation, data acquisition, energy storage, intelligent transportation, security monitoring, medical devices, edge gateways, and factory automation. It combines the Rockchip RK3576J industrial‑grade SoC (4*ARM Cortex-A72 @1.6GHz + 4*ARM Cortex-A53 @1.4GH) with LPDDR5 memory, delivering robust computing and AI performance. Storage and acceleration are expandable via an M.2 (PCIe) 2280 slot, with eMMC and UFS options.
Industrial I/O & Connectivity
Front: Dual GbE · 4×USB 3.0 · HDMI · Mini DP · Audio
Rear: WiFi/BT · 4G/5G Antenna · DC 12~36V
Connectivity Overview
1× HDMI — up to 4K@120Hz
1× Mini DisplayPort — up to 4K@60Hz
1× 3.5mm Audio Jack (headphone + mic)
2× Gigabit Ethernet (10/100/1000Mbps)
4× USB 3.0 Type‑A Host Ports
1× Type‑C USB‑UART Debug Interface
2× CAN FD with isolation
2× RS485 with isolation, 1× RS232 with isolation, 1× RS485/RS232 with isolation
4× DI with isolation, 4× DO with isolation
Onboard WiFi 6 (802.11a/b/g/n/ac/ax) + Bluetooth 5.4
1× Mini‑PCIe slot for 4G/5G module + 1× Micro SIM card slot
4GB LPDDR5 RAM (8GB available as customization)
32GB eMMC (64GB or 128GB UFS available as customization)
1× Micro SD card slot | 1× M.2 (PCIe) M‑Key 2280 for SSD / AI accelerator
4KB EEPROM for system data retention
Rugged Fanless Design for Industrial Environments
Operating Temperature: -40°C to +85°C (industrial grade)
Enclosure: Aluminum alloy, fanless passive cooling
Dimensions: 150×150×49mm (without bracket) · 170×150×49mm (with bracket)
Net Weight: 840g
Power Input: 12~36V DC / 5A (Phoenix connector)
Supercapacitor: 5‑second hold‑up after power loss
Watchdog Timer: External, for system recovery
RTC: External, with 3.3V battery backup
Status LEDs: Power/System · WiFi · PCIe SSD · 4G/5G
Installation: Desktop / Wall‑mount / DIN‑rail (customizable)
Buttons: Reset · RECOVERY · MASKROM
Comprehensive Software Ecosystem
| Component | Details & Source Code |
|---|---|
| Bootloader | U‑Boot 2017.09 Open Source |
| Linux Kernel | Kernel 6.1 (Rockchip official base, customized) Open Source |
| File System | Debian · Yocto Linux · Yocto Preempt‑RT Open Source |
| Peripheral Drivers | USB · Ethernet · HDMI · DP · Audio · RTC · WiFi · BT · MIPI DSI · CAN · RS232 · RS485 · GPIO Open Source |
Full source code, product manuals, user guides, and development references are provided to support integration and secondary development.
📦 Availability & Ordering
| Part Number | Configuration |
|---|---|
| MIC‑B5760‑IB411000 | 4GB LPDDR5 + 32GB eMMC (Industrial -40~85°C) |
Custom memory/storage configurations, M.2 AI accelerator cards, and full OEM/ODM services available upon request.
Visit Product Page →Get Started with the MIC‑B5760
About MYIR
MYIR Electronics Limited is a provider of ARM‑based embedded System‑on‑Modules (SoMs) and hardware solutions. Founded in 2011 and headquartered in Shenzhen, China, MYIR works with customers across industrial control, medical devices, IoT, and consumer electronics. The company offers hardware design, BSP support, and customization services to help engineering teams move from prototype to production.
.
2026-06-17
MYIR Unveils MAC-B5760 AI Edge IPC Box: Empowering Next-Generation Edge Intelligence with Rockchip RK3576 and Scalable AI Acceleration
MYIR launches the MAC-B5760 fanless AI edge IPC box powered by Rockchip RK3576, with 6 TOPS NPU and M.2 PCIe expansion for machine vision, robotics and smart retail.
2026-04-27
MYC-YF13X SDK Update：Triple Upgrade in System, Security & Functionality
MYIR introduces the STM32MP135F to the MYC-YF13X System-On-Module, which comes with security features compliant with the EU's Cyber Resilience Act (CRA).
2026-04-21
MYIR Launches Renesas RZ/T2H-based SoM for High-Performance Industrial Real-Time Control
MYIR announced the launch of the MYC-YT2HX SoM, and its companion development board, the MYD-YT2HX, Built around the powerful Renesas RZ/T2H processor (R9A09G077M44GBG).
2026-04-09
MYIR Launches Allwinner T153-Based MYC-YT153MX SOM for Industrial Intelligence
MYIR Launches Allwinner T153-Based MYC-YT153MX System-on-Module for Industrial Intelligence
2026-03-19
SDK Updates: MYC-YR3506/MYC-LT527X/MYC-YM62X/MYC-LMX9X
SDK Updates: MYC-YR3506/MYC-LT527X/MYC-YM62X/MYC-LMX9X
2026-03-04
MYIR Launches Low-Power TI AM62Lx-based SoM for Industrial & IoT, Featuring 3x CAN-FD and 8x UART
MYIR has launched the MYC-YM62LX System-on-Module (SoM) based on the Texas Instruments AM62Lx processor (AM62L32BOGHAANBR), alongside its development board, the MYD-YM62LX.
2026-01-04
MYIR Launches Upgraded ARM+FPGA System-On-Module Based on AMD Zynq UltraScale+ MPSoC
MYIR launches its new high-performance MYC-CZU3EG-V3 System-On-Module (SOM), powered by the AMD Zynq UltraScale+ ZU3EG MPSoC.
2025-12-25
MYC-LF25X: Built-in Full-Stack Security for Seamless CRA & IEC 62443 Compliance
Achieve CRA and IEC 62443 compliance with MYIR's MYC-LF25X SOM. This one-stop solution features embedded full-stack security, SESIP Level 3 certified hardware, and a mature ecosystem for safe product development.
2025-11-07
SDK Updates: MYC-YF13X/MYC-LD25X
SDK Update Notice for STM32MP135 and STM32MP257 SOMs