MYIR Launches Rockchip RK3576-Based MYC-JR3576 SMARC SOM for Edge AI and Industrial Applications

Shenzhen, China - October 21, 2026 - MYIR, a provider of embedded System-on-Modules (SoMs) and hardware solutions, today announced the launch of the MYC-JR3576, a compact SMARC 2.2 System-on-Module powered by the Rockchip RK3576/RK3576J processor. Combining an octa-core 64-bit Arm CPU, a Cortex-M0 real-time core, a 6 TOPS NPU, and an Arm Mali-G52 MC3 3D GPU, the module targets edge computing, robotics, industrial control, medical endoscopy, construction machinery, and commercial and industrial energy storage. It joins MYIR's LGA-packaged MYC-LR3576 to give developers a choice between an ultra-compact 43 mm × 45 mm LGA module and a standards-based SMARC 2.2 module for scalable edge-AI and industrial designs.

MYC-JR3576 System-On-Module (Top-view and Bottom-view)

Measuring 82 mm × 50 mm, the MYC-JR3576 combines four Cortex-A72 cores and four Cortex-A53 cores for application processing, alongside a Cortex-M0 core running at 400 MHz for real-time control. The commercial-grade RK3576 operates at up to 2.2 GHz for the Cortex-A72 cores and 2.0 GHz for the Cortex-A53 cores, while the industrial-grade RK3576J operates at up to 1.6 GHz and 1.4 GHz, respectively. The integrated 6 TOPS INT8 NPU provides edge AI inference acceleration, complemented by the Arm Mali-G52 MC3 GPU for graphics processing. The processor's multimedia engine supports video decoding at up to 8K at 30 fps or 4K at 120 fps in H.265/HEVC, VP9, AVS2, and AV1 formats, as well as video encoding at up to 4K at 60 fps in H.265 and H.264 formats.

The MYC-JR3576 integrates memory, wireless connectivity, security components, a Gigabit Ethernet PHY, and a USB 3.0 hub in a compact design. Its main hardware features include:

Processor: Rockchip RK3576/RK3576J, octa-core 64-bit Arm CPU with 4× Cortex-A72 and 4× Cortex-A53 cores, plus a Cortex-M0 real-time core at 400 MHz

AI Performance: Integrated 6 TOPS NPU (INT8) and Arm Mali-G52 MC3 3D GPU

Memory & Storage: 4GB/8GB LPDDR5, 32GB/64GB eMMC, and 32Kbit EEPROM

Wireless Connectivity: Onboard Wi-Fi 6 and Bluetooth 5.4 module

Security: Independent TPM 2.0 security chip and the RK3576's built-in security subsystem, with an onboard Power Management IC (PMIC)

Expansion: 314-pin SMARC 2.2 connector providing signals for dual Gigabit Ethernet, 1× PCIe 2.1 / 1× SATA3, 2× USB 3.0 Host, 2× USB 2.0 Host, 1× USB 2.0 OTG, 2× CAN FD, 4× UART, 2× SPI, 4× I2C, 1× SDIO, 3× PWM, 14× GPIO, and 2× SAI. Display and camera connectivity includes HDMI, DP, MIPI-DSI/LVDS, and 3× MIPI-CSI interfaces (2× 4-lane and 1× 2-lane). Optional SARADC connectivity provides six channels with 12-bit resolution and a sampling rate of up to 1 MS/s.
Note: interface counts represent the maximum signals listed for the expansion interface. Some signals are multiplexed.

Operating Temperature and Design: 0°C to +70°C for the commercial grade and −40°C to +85°C for the industrial grade; 12-layer PCB design; +5V/2A power supply

Accelerate Development with the MYD-JR3576 Companion Board

The MYD-JR3576 development board combines the MYC-JR3576 SOM with a carrier board through the 314-pin SMARC connector. It provides evaluation interfaces for dual Gigabit Ethernet, a mini-PCIe socket with dual micro-SIM support for 4G/5G modules, M.2-2280 PCIe for NVMe SSD, and MicroSD storage. USB connectivity includes 2× USB 3.0 Host, 1× USB 2.0 Host, and 1× USB 2.0 OTG. For display and imaging evaluation, the board supports HDMI, MIPI-DSI/LVDS, and DisplayPort, together with two MIPI-CSI camera inputs and audio I/O. Dual CAN FD, RS485, and RS232 share a single Phoenix connector. These interfaces provide a platform for rapid prototyping in edge AI, industrial control, and robotics applications.

MYD-JR3576 Development Board (Top-view, delivered with heatsink pre-installed)

MYD-JR3576 Development Board (Bottom-view)

Optional Accessories for a Ready-to-Use Experience

MYIR offers optional display and camera accessories for the MYD-JR3576, including the MY-MIPI101C-V2 10.1-inch MIPI display and MY-LVDS070C 7-inch LVDS display, both with capacitive touch screens. The MY-CAM003M 5MP and MY-CAM005M 13MP MIPI-CSI camera modules provide additional options for imaging evaluation.

MYC-JR3576 Function Block Diagram

MYD-JR3576 Function Block Diagram

The MYC-JR3576 supports Linux and Android, with a software package that includes BSPs, peripheral drivers, and documentation. Source code for the kernel and various peripheral drivers is provided to help developers accelerate their projects. The main software components include:

• Bootloader: U-Boot 2017.09, with source code provided

• Linux Kernel: Customized based on the official Linux 6.1 kernel, with source code provided

• File Systems: myir-image-jr3576-android, built on Android 15, and myir-image-jr3576-yocto, built using Yocto, with source code provided

• Peripheral Drivers: Source code is provided for the listed EEPROM, Ethernet, Wi-Fi, Bluetooth, 4G/5G, LVDS, MIPI-DSI, HDMI, DP, MIPI-CSI, audio, RTC, MicroSD, RS485/RS232, CAN, and GPIO drivers

Ordering options for the MYC-JR3576 SOM include MYC-JR3576-64E8D-220-C and MYC-JR3576J-32E4D-160-I. The standalone SOM package contains one module; a heatsink is not included. The MYD-JR3576 development board is offered under part numbers MYD-JR3576-64E8D-220-C and MYD-JR3576J-32E4D-160-I. Each package includes a development board with the MYC-JR3576 SOM installed, a 12V/2A power adapter, a USB Type-A to Type-C cable, a Quick Start Guide, one Wi-Fi IPEX antenna, and one Wi-Fi rod antenna. MYIR also accepts custom hardware designs based on the MYD-JR3576, including reducing, adding, or modifying existing hardware to meet customer requirements. Bulk discounts are available upon inquiry.

For more information, pricing, or product inquiries, please visit the official product page:
https://en.myir.cn/RK3576/178.html

Additional resources: Download Datasheet · Order Evaluation Unit · Contact Sales · Contact FAE
Related: MYC-LR3576 (43 mm x 45 mm LGA module) 

About MYIR

MYIR Electronics Limited, established in 2011 and headquartered in Shenzhen, China, is a global provider of embedded System-on-Modules (SoMs), single board computers, and application-ready solutions based on ARM, FPGA, RISC-V, and AI architectures. Recognized as a national high-tech enterprise and a Shenzhen "Specialized and Special New" enterprise, MYIR operates a 7,000 m² R&D and manufacturing base and serves customers worldwide across industrial control, AI edge computing, medical devices, energy storage, and IoT. With ISO9001, ISO14001 and ISO13485 certified processes, a product lifecycle commitment of no less than 10 years, and one-stop OEM/ODM services, MYIR helps engineering teams move from prototype to volume production. The MYC-JR3576 SMARC 2.2 module and MYD-JR3576 development board extend MYIR's edge-AI and industrial portfolio with the same long-term supply and customization support.